JPS59178768A - 複合部品 - Google Patents

複合部品

Info

Publication number
JPS59178768A
JPS59178768A JP5243183A JP5243183A JPS59178768A JP S59178768 A JPS59178768 A JP S59178768A JP 5243183 A JP5243183 A JP 5243183A JP 5243183 A JP5243183 A JP 5243183A JP S59178768 A JPS59178768 A JP S59178768A
Authority
JP
Japan
Prior art keywords
substrate
dielectric
composite component
composite
chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP5243183A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0474868B2 (en]
Inventor
Minoru Takatani
稔 高谷
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TDK Corp
Original Assignee
TDK Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by TDK Corp filed Critical TDK Corp
Priority to JP5243183A priority Critical patent/JPS59178768A/ja
Publication of JPS59178768A publication Critical patent/JPS59178768A/ja
Publication of JPH0474868B2 publication Critical patent/JPH0474868B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/16—Assemblies consisting of a plurality of semiconductor or other solid state devices the devices being of types provided for in two or more different subclasses of H10B, H10D, H10F, H10H, H10K or H10N, e.g. forming hybrid circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
JP5243183A 1983-03-30 1983-03-30 複合部品 Granted JPS59178768A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5243183A JPS59178768A (ja) 1983-03-30 1983-03-30 複合部品

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5243183A JPS59178768A (ja) 1983-03-30 1983-03-30 複合部品

Publications (2)

Publication Number Publication Date
JPS59178768A true JPS59178768A (ja) 1984-10-11
JPH0474868B2 JPH0474868B2 (en]) 1992-11-27

Family

ID=12914566

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5243183A Granted JPS59178768A (ja) 1983-03-30 1983-03-30 複合部品

Country Status (1)

Country Link
JP (1) JPS59178768A (en])

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63261904A (ja) * 1987-04-20 1988-10-28 Matsushita Electric Ind Co Ltd 搬送波検出用混成集積回路
JPS6413137U (en]) * 1987-06-23 1989-01-24
JPS6464240A (en) * 1987-09-03 1989-03-10 Tdk Corp Ic package
JPH02102737U (en]) * 1989-02-02 1990-08-15
EP0789390A3 (en) * 1989-01-14 1998-01-14 TDK Corporation A method for producing multilayer hybrid circuit

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS49120160A (en]) * 1973-03-26 1974-11-16
JPS568854A (en) * 1979-07-04 1981-01-29 Mitsubishi Electric Corp Package for semiconductor device

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS49120160A (en]) * 1973-03-26 1974-11-16
JPS568854A (en) * 1979-07-04 1981-01-29 Mitsubishi Electric Corp Package for semiconductor device

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63261904A (ja) * 1987-04-20 1988-10-28 Matsushita Electric Ind Co Ltd 搬送波検出用混成集積回路
JPS6413137U (en]) * 1987-06-23 1989-01-24
JPS6464240A (en) * 1987-09-03 1989-03-10 Tdk Corp Ic package
EP0789390A3 (en) * 1989-01-14 1998-01-14 TDK Corporation A method for producing multilayer hybrid circuit
JPH02102737U (en]) * 1989-02-02 1990-08-15

Also Published As

Publication number Publication date
JPH0474868B2 (en]) 1992-11-27

Similar Documents

Publication Publication Date Title
US5224021A (en) Surface-mount network device
JPS583397B2 (ja) コンセイビシヨウブヒン
JPS59178768A (ja) 複合部品
JPH0210598B2 (en])
JPS5917232A (ja) 複合積層セラミツク部品およびその製造方法
JPS5914693A (ja) プリント基板装置の製造方法
JPS6221260B2 (en])
JPH06124850A (ja) 積層複合電子部品
JPS5950596A (ja) チツプ状電子部品およびその製造方法
JP2839262B2 (ja) チップ抵抗器とその製造方法
JPH0626216U (ja) 積層型コイル部品
JPH06342734A (ja) セラミック電子部品
JP2577583B2 (ja) 積層応用部品
JP2003078103A (ja) 回路基板
JP2839308B2 (ja) 多層配線基板
JPH0533016Y2 (en])
JPS6347248B2 (en])
JP2533603Y2 (ja) Ｌｃ複合部品
JPH0338919U (en])
JPH0394452A (ja) 半導体集積回路用パッケージ
JPS6390113A (ja) 抵抗−コンデンサ複合部品
JPS60176296A (ja) グレ−ズ抵抗素子一体型多層基板の製造方法
JPH0544200B2 (en])
JPH051100Y2 (en])
JPS63194395A (ja) 厚膜混成集積回路装置